Discrete electronic device embedded in chip module

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United States of America Patent

PATENT NO 9980385
SERIAL NO

15494672

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Abstract

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The invention relates to a method for embedding a discrete electronic device in a chip module. The chip module comprises a multilayer substrate which comprises a plurality of electrically conductive layers stacked above each other and an electrically non-conductive layer arranged between each pair of electrically conductive layers. The chip module is configured to receive one or more chips to be mounted onto a top surface thereof. Each electrically conductive layer comprises one or more electrically conductive structures. A recess is provided in a side surface of the chip module. The discrete electronic device is inserted into the recess. A first electrically conductive connection between a first electrical contact of the discrete electronic device and a first electrically conductive structure is established. Further, a second electrically conductive connection between a second electrical contact of the discrete electronic device and a second electrically conductive structure is established.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huber, Andreas Leonberg, DE 184 1208
Huels, Harald Horb am Neckar, DE 25 184
Oggioni, Stefano S Besana in Brianza, IT 72 757
Strach, Thomas Wildberg, DE 21 51
Winkel, Thomas-Michael Schoenaich, DE 23 90

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