Circuit carrier and a method for producing a circuit carrier

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United States of America Patent

PATENT NO 10129987
APP PUB NO 20180027667A1
SERIAL NO

15550086

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The invention relates to a circuit carrier (1) comprising a plurality of inorganic substrate layers (1.1) that have partial metallizations (1.2, 1.3, 1.4, 1.5, 1.6) for the purpose of electrical and/or thermal conduction, and to a corresponding method for producing such a circuit carrier (1). According to the invention, at least one partial metallization is made in the form of an insert (1.2) that fills a corresponding shaped hole (1.7) introduced into one of said inorganic substrate layers (1.1).

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Patent Owner(s)

  • ROBERT BOSCH GMBH

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bueyuekgoez, Harun Pfullingen, DE 1 1
Gerstner, Roland Reutlingen, DE 5 47
Weber, Josef Reutlingen, DE 30 185

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