REARWARD ACOUSTIC DIFFUSION FOR ULTRASOUND-ON-A-CHIP TRANSDUCER ARRAY

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United States of America Patent

SERIAL NO

15223550

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Abstract

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A heat sink device has a non-planar mounting surface and an ultrasonic transducer substrate attached to the non-planar mounting surface. The non-planar mounting surface of the heat sink device is configured to diffuse acoustic waves that are incident thereupon.

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Patent Owner(s)

Patent OwnerAddress
BFLY OPERATIONS INC530 OLD WHITFIELD STREET 337 WASHINGTON STREET GUILDFORD CT 06437

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hageman, Matthew R Hoffman Estates, US 5 22
McNulty, Christopher Thomas Guilford, US 80 3191

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