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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
MITSUBISHI GAS CHEMICAL COMPANY INC	CHIYODA-KU TOKYO 100-8324

International Classification(s)

• C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
• C07C:ACYCLIC OR CARBOCYCLIC COMPOUNDS
• G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
ECHIGO, Masatoshi	Tokyo, JP	137	625
MAKINOSHIMA, Takashi	Kanagawa, JP	57	168
SATO, Takashi	Kanagawa, JP	973	9680
TOIDA, Takumi	Kanagawa, JP	22	64

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Aug 1, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Aug 1, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2018/0029,968

COMPOUND, RESIN, MATERIAL FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, COMPOSITION FOR FORMING UNDERLAYER FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, RESIST PATTERN FORMING METHOD, CIRCUIT PATTERN FORMING METHOD, AND PURIFICATION METHOD OF COMPOUND OR RESIN

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