METHOD FOR POLISHING SILICON WAFER AND SURFACE TREATMENT COMPOSITION
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United States of America Patent
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Jan 22, 2016
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Feb 12, 2015
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Abstract
There is provided a polishing method capable of more reducing defects on a silicon wafer surface. A polishing method of a silicon wafer, which includes a polishing step and a surface treatment step conducted after the polishing step and in which the number of abrasives in a surface treatment composition used in the surface treatment step is 1.0×1010 particles/mL or more and 1.0×1013 particles/mL or less.
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