HEAT DISSIPATION MODULE
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United States of America Patent
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app pub date -
Dec 2, 2016
filing date -
Jul 29, 2016
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Abstract
A heat dissipation module is provided, including a frame, a base, and a fan. The frame has a depressed portion at an inner edge thereof. The base is connected to the frame and has a bottom surface. The fan is movably disposed on the base and has a plurality of blades. The end of an upper edge of the blades has a first height with respect to the bottom surface. The depressed portion has a second height with respect to the bottom surface, wherein the first height is less than the second height.
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