APPARATUS AND METHOD FOR TREATING SUBSTRATE
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United States of America Patent
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Feb 1, 2018
app pub date -
Jul 22, 2017
filing date -
Jul 29, 2016
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Abstract
Disclosed are an apparatus and a method for treating a substrate. The method includes supplying a mixture liquid obtained by mixing an additive with an organic solvent onto a substrate, and after the supplying of the mixture liquid, removing the mixture liquid from the substrate by supplying a supercritical fluid to the substrate and dissolving the mixture liquid in the supercritical fluid, wherein the additive has a surface tension that is lower than that of the organic solvent and a boiling point that is lower than that of the organic solvent.
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