INTEGRATED CIRCUIT CHIP AND DISPLAY DEVICE INCLUDING THE SAME

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United States of America Patent

SERIAL NO

15656849

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Abstract

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An exemplary embodiment provides a driving circuit chip including: a substrate; a terminal electrode disposed on the substrate; and an electrode pad disposed on the terminal electrode, wherein the electrode pad includes: a bump structure protruded from the substrate to include a short side and a long side; and a bump electrode disposed on the bump structure and connected with the terminal electrode around a short edge portion of the bump structure, wherein the bump electrode is disposed to not cover at least a part of a long edge portion of the bump structure.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG DISPLAY CO LTD1 SAMSUNG-RO GIHEUNG-GU YONGIN-SI GYEONGGI-DO 17113

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HA, Seung-Hwa Hwaseong-si, KR 26 207
HWANG, Jeong Ho Cheonan-si, KR 41 167
JO, Jung Yun Namyangju-si, KR 28 57
SONG, Sang Hyeon Seoul, KR 12 51
YANG, Jeong Do Yongin-si, KR 11 68

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