Package structure having magnetic bonding between substrates
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United States of America Patent
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Dec 18, 2018
Grant Date -
Feb 1, 2018
app pub date -
Jul 29, 2016
filing date -
Jul 29, 2016
priority date (Note) -
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Abstract
A package structure and method for forming the same are provided. The package structure includes a first die, and the first die includes a first magnetic pad formed over a first substrate. The package structure includes a second die, and the second die includes a second magnetic pad formed over a second substrate. The package structure also includes a hybrid bonding structure formed between the first die and the second die of the second wafer. The hybrid bonding structure includes a magnetic bonding structure which is made of the first magnetic pad and the second magnetic layer.
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