Circuit boards and semiconductor packages including protruding pattern on substrate
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United States of America Patent
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Nov 13, 2018
Grant Date -
Feb 1, 2018
app pub date -
Jul 7, 2017
filing date -
Jul 29, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A circuit board comprises a mother substrate including first and second scribing regions, the first scribing region extending in first direction, the second scribing region extending in second direction, the first and second directions crossing each other, the mother substrate including chip regions defined by the first and second scribing regions, and a through via penetrating the chip regions of the mother substrate. The mother substrate comprises a first alignment pattern protruding from a top surface of the mother substrate. The first alignment pattern is disposed on at least one of the scribing regions.
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