Semiconductor device and semiconductor system equipped with the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10224858
APP PUB NO 20180034404A1
SERIAL NO

15597092

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Abstract

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A semiconductor device includes a semiconductor chip, a lead frame and one bonding wire and the other bonding wire which couple together the semiconductor chip and the lead frame. The semiconductor chip includes one pad which is coupled to one bonding wire and to which an output signal which has been generated in the semiconductor chip is supplied, the other pad which is coupled to the other bonding wire and to which a feedback signal is supplied from the lead frame and a fault detection circuit which compares the output signal which is supplied to one pad with the feedback signal which is supplied to the other pad.

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Patent Owner(s)

  • RENESAS ELECTRONICS CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Takemura, Narihira Tokyo, JP 8 114

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