Heat dissipating structure and electronic device
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United States of America Patent
Stats
-
Apr 23, 2019
Grant Date -
Feb 1, 2018
app pub date -
Jul 26, 2017
filing date -
Jul 28, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A heat dissipating structure includes an integrated circuit; a bracket; a heat sink; a housing; a first fastening member that is inserted into a first fastening hole provided to the bracket, and is inserted into a fastening hole provided to the heat sink, and that assembles the integrated circuit to the bracket and the heat sink, while a surface of the integrated circuit contacts with the bracket, and another surface contacts with the heat sink; and a second fastening member that is inserted into a second fastening hole provided to the bracket, and into a fastening hole provided to the housing, and assembles the bracket to the housing. The heat sink includes one surface that contacts with the housing, the one surface being on a side opposite to a surface contact with the integrated circuit, and the one first fastening member is positioned spaced from the housing.
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