Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling

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United States of America Patent

PATENT NO 10349513
APP PUB NO 20180035533A1
SERIAL NO

15659187

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Abstract

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A system includes: a printed circuit board having a plurality of conductive traces; a processing device coupled to the printed circuit board and in electrical communication with the plurality of conductive traces; a first memory module and a second memory module in electrical communication with the plurality of conductive traces and sharing channels of the conductive traces, wherein the first memory module is physically more proximate to the processing device than is the second memory module; and an electronic band gap (EBG) structure physically disposed in an area between the first memory module and the second memory module.

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Patent Owner(s)

  • QUALCOMM INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pathmanathan, Priyatharshan Wake Forest, US 3 3

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