Polyimide precursor resin composition

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United States of America Patent

PATENT NO 10711105
APP PUB NO 20180037698A1
SERIAL NO

15555779

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Abstract

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This resin composition is characterized by comprising (a) 100 parts by mass of a polyimide precursor containing a structural unit represent by general formula (1) (wherein, R1 and R2 are each independently selected from a hydrogen atom, monovalent aliphatic hydrocarbons having 1-20 carbon atoms, and aromatic groups, and X1 is a tetravalent organic group having 4-32 carbon atoms), (b) 0.001-5 parts by mass of a silicone-based surfactant, and (c) an organic solvent.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI KABUSHIKI KAISHATOKYO 100-0006

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Iizuka, Yasuhito Tokyo, JP 9 23
Kanada, Takayuki Tokyo, JP 8 39
Maitani, Masaki Tokyo, JP 5 12
Miyamoto, Yoshiki Tokyo, JP 15 86

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