Substrate processing apparatus, recording medium, and fluid circulation mechanism

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United States of America Patent

PATENT NO 11694907
APP PUB NO 20180040488A1
SERIAL NO

15667106

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A substrate processing apparatus, includes a reaction furnace, a preparatory chamber provided below the reaction furnace, an elevating mechanism configured to raise/lower a substrate holder between the reaction furnace and the preparatory chamber, a fluid circulation mechanism including a suction part for sucking a fluid within the preparatory chamber, a pipe part constituting a flow path through which the fluid flows from the suction part to a supply part, and a cooling mechanism, provided in the flow path, for cooling the fluid, and a control part for controlling the fluid circulation mechanism and the elevating mechanism to circulate the fluid sucked from the suction part through the flow path, and supply the fluid from the supply part to the preparatory chamber. The cooling mechanism is disposed adjacent to the suction part to cool the fluid introduced from the suction part before circulating the fluid through the flow path.

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Patent Owner(s)

  • KOKUSAI ELECTRIC CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujino, Toshiki Toyama, JP 37 1179
Nakada, Takayuki Toyama, JP 68 1560
Umekawa, Atsushi Toyama, JP 19 396

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