Air cavity package
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United States of America Patent
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Feb 19, 2019
Grant Date -
Feb 8, 2018
app pub date -
Oct 20, 2017
filing date -
Sep 1, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A leadframe and air cavity packages formed using the leadframe are described. Using the leadframe, several air cavity packages can be quickly formed at one time. A method of manufacture using the leadframe can include forming the leadframe from a strip conductive material, where the leadframe includes conductive leads and downset facets. The method can also include forming slugs from conductive material, and arranging the slugs into respective positions relative to the downset facets of the leadframe. The method can also include fastening the slugs to the leadframe using the downset facets, and forming plastic packages around the leadframe and the slugs, where each of the plastic packages includes an air cavity in which at least a portion of a respective one of the slugs and at least a portion of a respective one of the conductive leads is exposed.
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