ELECTRONIC COMPONENT-MOUNTED BODY AND METHOD FOR MANUFACTURING SAME

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United States of America Patent

SERIAL NO

15667835

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Abstract

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An electronic component-mounted body (1) in accordance with an embodiment of the present invention is configured such that an IC chip (20) is fixed, with use of a post (30) having a thermosetting property, to a wiring substrate (10) having an anisotropic linear expansion coefficient.

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Patent Owner(s)

Patent OwnerAddress
FUJIKURA LTD5-1 KIBA 1-CHOME KOTO-KU TOKYO 135-8512

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wada, Hideyuki Sakura-shi, JP 13 39

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