ELECTRONIC COMPONENT-MOUNTED BODY AND METHOD FOR MANUFACTURING SAME

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Aug 3, 2017
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Aug 8, 2016

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Abstract

An electronic component-mounted body (1) in accordance with an embodiment of the present invention is configured such that an IC chip (20) is fixed, with use of a post (30) having a thermosetting property, to a wiring substrate (10) having an anisotropic linear expansion coefficient.

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FUJIKURA LTD	TOKYO

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Wada, Hideyuki	Sakura-shi, JP	21	77

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ELECTRONIC COMPONENT-MOUNTED BODY AND METHOD FOR MANUFACTURING SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

15667835

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15667835

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