METHOD OF MAKING INTERCONNECT SUBSTRATE HAVING ROUTING CIRCUITRY CONNECTED TO POSTS AND TERMINALS
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United States of America Patent
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Issued Date -
Feb 8, 2018
app pub date -
Oct 16, 2017
filing date -
Mar 7, 2014
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Abstract
A method of making an interconnect substrate includes steps of: providing a base and a plurality of posts projecting from the base, providing a dielectric compound on the base, forming a top routing circuitry on the dielectric compound and electrically coupled to the posts; and selectively removing portions of the base to form a plurality of terminals. The terminals are below the posts and extend laterally from the posts to provide electrical contacts underneath the dielectric compound. The dielectric compound covers sidewalls of the posts and provides a dielectric platform for the top routing circuitry deposited thereon. The top routing circuitry laterally extends on the dielectric compound and is electrically connected to the terminals by the posts.
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