Wiring board and method for manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10813232
APP PUB NO 20180042124A1
SERIAL NO

15671451

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A wiring board includes core substrate, a first build-up layer on first surface of the substrate and including conductive and insulating resin layers, and a second build-up layer on second surface of the substrate and including conductive and insulating resin layers. The first build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of each conductive layer on a non-outermost resin layer, and the second build-up is formed such that each conductive layer includes a metal foil layer and a plating layer on the foil layer and the foil layer of a conductive layer on an outermost resin layer has thickness greater than thickness of the foil layer of each conductive layer on a non-outermost resin layer.

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Patent Owner(s)

Patent OwnerAddress
IBIDEN CO LTDOGAKI-SHI GIFU 503-8604

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Makino, Toshihide Ogaki, JP 16 26
Noguchi, Hidetoshi Ogaki, JP 51 261

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