Polishing agent, stock solution for polishing agent, and polishing method

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United States of America Patent

PATENT NO 10946494
APP PUB NO 20180043497A1
SERIAL NO

15556824

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Abstract

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A polishing agent for polishing a resin comprises abrasive grains, a water-soluble polymer having an ether bond, an organic solvent and water, wherein the abrasive grains have a positive charge in the polishing agent and an average particle diameter of the abrasive grains is larger than 20 nm.

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Patent Owner(s)

  • SHOWA DENKO MATERIALS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goh, Yutaka Tokyo, JP 1 24
Hanano, Masayuki Tokyo, JP 14 80
Iwano, Tomohiro Tokyo, JP 51 275
Nishiyama, Masaya Tokyo, JP 10 230
Sakurai, Haruaki Tokyo, JP 15 121

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