Polyamic acid resin, polyamideimide film, and method for preparing the same

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United States of America Patent

PATENT NO 10370495
APP PUB NO 20180044475A1
SERIAL NO

15668964

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Abstract

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Provided are a polyamic acid resin, a polyamideimide film, and a method for preparing the same. More specifically, provided are a polyamic acid resin derived from a combination of specific components, a polyamideimide film capable of implementing high modulus and excellent optical properties while implementing excellent mechanical properties, heat properties, and electrical properties, and a method for preparing the same.

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Patent Owner(s)

  • SK INNOVATION CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jang, Tae Sug Daejeon, KR 14 31
Kim, Hyeon Jeong Daejeon, KR 16 90
Park, Jin Hyung Daejeon, KR 37 84
Park, Sang Yoon Daejeon, KR 59 120

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