METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE ADHESIVE FILM, ELECTRICALLY CONDUCTIVE ADHESIVE FILM, AND METHOD FOR MANUFACTURING CONNECTOR

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United States of America Patent

SERIAL NO

15729162

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Abstract

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A step of scattering electrically conductive particles on a wiring board having wiring that is formed in accordance with an array pattern of the electrically conductive particles and prevented from being charged, and charging the electrically conductive particles; a step of aligning the charged electrically conductive particles in a predetermined array pattern corresponding to the wiring pattern by moving a squeegee on the wiring board; and a step of bonding a transfer film having an adhesive material layer formed thereon to the wiring board and transferring the electrically conductive particles aligned in a predetermined array pattern to the adhesive layer.

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Patent Owner(s)

Patent OwnerAddress
DEXERIALS CORPORATIONSHIMOTSUKE-SHI TOCHIGI 323-0194

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SHINOHARA, Seiichiro Kanuma-shi, JP 23 82

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