Heterogeneous spectroscopic transceiving photonic integrated circuit sensor
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United States of America Patent
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Nov 27, 2018
Grant Date -
Feb 15, 2018
app pub date -
Oct 3, 2017
filing date -
Sep 29, 2014
priority date (Note) -
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Abstract
Described herein are optical sensing devices for photonic integrated circuits (PICs). A PIC may comprise a plurality of waveguides formed in a silicon on insulator (SOI) substrate, and a plurality of heterogeneous lasers, each laser formed from a silicon material of the SOI substrate and to emit an output wavelength comprising an infrared wavelength. Each of these lasers may comprise a resonant cavity included in one of the plurality of waveguides, and a gain material comprising a non-silicon material and adiabatically coupled to the respective waveguide. A light directing element may direct outputs of the plurality of heterogeneous lasers from the PIC towards an object, and one or more detectors may detect light from the plurality of heterogeneous lasers reflected from or transmitted through the object.
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