System and method for electronic die inking after automatic visual defect inspection

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10902576
APP PUB NO 20180047149A1
SERIAL NO

15497925

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Abstract

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A method of providing a semiconductor device and a computer-readable medium having instructions for performing the method are disclosed. The method includes receiving a first wafer defect map that defines comparison regions and identifies visual defect locations for a wafer. A format of the comparison regions is determined, with the format chosen from a group including die-to-die, partial-shot-to-partial-shot and full-shot-to-full-shot. If the comparison format is not die-to-die, mapping information is received that provides die locations within the comparison regions. A wafer layout map is provided that identifies die locations within the wafer.

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Patent Owner(s)

  • AGILENT TECHNOLOGIES TEXAS INSTRUMENTS INCORPORATED

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Button, Jon Evan Dallas, US 1 5
Curran, David Matthew Plano, US 4 6
Gordon, Charles David McKinney, US 1 5
Jenson, Michael Jay Richardson, US 1 5
Paquette, Brant William Allen, US 1 5
Samek, Vince Christian Richmond, US 1 5
Trumbauer, Eric Robert Celina, US 1 5

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