Method for manufacturing electronic component

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10770205
APP PUB NO 20180047484A1
SERIAL NO

15728571

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for manufacturing an electronic component including a step of providing an outer electrode that includes a step of providing a sintered layer containing a sintered metal, a step of providing an insulation layer containing an electric insulation material, and a step of providing a Sn-containing layer containing Sn. The sintered layer extends from each of end surfaces of an element assembly onto at least one main surface thereof. The insulation layer is directly provided on the sintered layer at each of the end surfaces so as to extend in a direction perpendicular or substantially perpendicular to a side surface of the element assembly, and defines a portion of a surface of the outer electrode. The Sn-containing layer covers the sintered layer except for a portion of the sintered layer that is covered by the insulation layer, and constitutes another portion of the surface of the outer electrode.

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Patent Owner(s)

  • MURATA MANUFACTURING CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mori, Haruhiko Nagaokakyo, JP 24 128
Otsuna, Hiroyuki Nagaokakyo, JP 4 50

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