Reflow enhancement layer for metallization structures

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10170360
APP PUB NO 20180047625A1
SERIAL NO

15794576

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A reflow enhancement layer is formed in an opening prior to forming and reflowing a contact metal or metal alloy. The reflow enhancement layer facilitates the movement (i.e., flow) of the contact metal or metal alloy during a reflow anneal process such that a void-free metallization structure of the contact metal or metal alloy is provided.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINE CORPORATION

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Adusumilli, Praneet Albany, US 163 794
Reznicek, Alexander Troy, US 1408 11211
van, der Straten Oscar Guilderland Center, US 173 878

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 1, 2026
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 1, 2030
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00