Standalone interface for stacked silicon interconnect (SSI) technology integration

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10784121
APP PUB NO 20180047663A1
SERIAL NO

15237384

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Abstract

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Methods and apparatus are described for adding one or more features (e.g., high bandwidth memory (HBM)) to an existing qualified stacked silicon interconnect (SSI) technology programmable IC die (e.g., a super logic region (SLR)) without changing the programmable IC die (e.g., adding or removing blocks). One example integrated circuit (IC) package generally includes a package substrate; at least one interposer disposed above the package substrate and comprising a plurality of interconnection lines; a programmable IC die disposed above the interposer; a fixed feature die disposed above the interposer; and an interface die disposed above the interposer and configured to couple the programmable IC die to the fixed feature die using a first set of interconnection lines routed through the interposer between the programmable IC die and the interface die and a second set of interconnection lines routed through the interposer between the interface die and the fixed feature die.

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Patent Owner(s)

  • XILINX INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Camarota, Rafael C San Jose, US 51 1567

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