Bonded substrate, surface acoustic wave element, surface acoustic wave device, and method of manufacturing bonded substrate
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United States of America Patent
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Jul 2, 2019
Grant Date -
Feb 15, 2018
app pub date -
Feb 3, 2017
filing date -
Aug 10, 2016
priority date (Note) -
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Abstract
There is provided a bonded substrate including: a quartz substrate; and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded at a bonding interface through covalent bonding, and a surface acoustic wave element having a higher phase velocity and a higher electromechanical coupling factor than conventional one is obtained by disposing an interdigital electrode on a principal surface of the piezoelectric substrate.
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