Multilayer bus board

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10485092
APP PUB NO 20180049310A1
SERIAL NO

15552116

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned abutting relation.

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Patent Owner(s)

  • INTERPLEX INDUSTRIES, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lynch, Joseph J East Northport, US 9 422
Schneider, Richard Livonia, US 84 1708

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