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Abstract

A printed wiring board includes a central resin insulating layer, an electronic component embedded in the central insulating layer, a first resin insulating layer formed on first surface side of the central insulating layer, a second resin insulating layer formed on second surface side of the central insulating layer, via conductors formed in the central insulating layer such that the via conductors are formed toward the first surface side, and metal posts formed in the central insulating layer such that the metal posts are formed toward the second surface side. The central insulating layer does not contain a core material, and the via conductors include a group of via conductors connected with the metal posts respectively such that a via conductor and a respective metal post connected to the via conductor is connecting a first surface and a second surface of the central insulating layer on the opposite side.

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First Claim