Carbon Fiber Bundle for Resin Reinforcement, and Method for Manufacturing Carbon Fiber Bundle for Resin Reinforcement, Carbon-Fiber-Reinforced Thermoplastic Resin Composition, and Molded Body

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United States of America Patent

SERIAL NO

15798711

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Abstract

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A carbon fiber bundle for resin reinforcement, wherein there are adhered by 0.1-5.0 mass % to a carbon fiber bundle in which multiple lengths of filament are bundled, a mixture created by mixing an organic polymer (A) having a mass-average molecular weight of 10000 or more and an organic compound (B) the thermal reduction rate specified in claim 1 of which is 5 mass % or more or an organic compound (B) the thermal reduction rate specified in claim 2 of which is 0.8 mass % or more, the amount of the organic polymer (A) adhered being 0.1 mass % or more.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI CHEMICAL CORPORATION1-1 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 100-8251

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujita, Saki Otake-shi, JP 13 62
Harada, Akira Toyohashi-shi, JP 98 614
Ohtani, Tadashi Toyohashi-shi, JP 11 41
Takahashi, Atsushi Toyohashi-shi, JP 428 3464

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