Measurement Of Multiple Patterning Parameters

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United States of America Patent

APP PUB NO 20180051984A1
SERIAL NO

15784153

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Abstract

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Methods and systems for evaluating the performance of multiple patterning processes are presented. Patterned structures are measured and one or more parameter values characterizing geometric errors induced by the multiple patterning process are determined. In some examples, a single patterned target and a multiple patterned target are measured, the collected data fit to a combined measurement model, and the value of a structural parameter indicative of a geometric error induced by the multiple patterning process is determined based on the fit. In some other examples, light having a diffraction order different from zero is collected and analyzed to determine the value of a structural parameter that is indicative of a geometric error induced by a multiple patterning process. In some embodiments, a single diffraction order different from zero is collected. In some examples, a metrology target is designed to enhance light diffracted at an order different from zero.

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Patent Owner(s)

Patent OwnerAddress
KLA-TENCOR CORPORATIONONE TECHNOLOGY DRIVE MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dziura, Thaddeus Gerard San Jose, US 16 92
Krishnan, Shankar Santa Clara, US 82 499
Pandev, Stilian Ivanov Santa Clara, US 41 389
Peterlinz, Kevin Fremont, US 12 170
Sapiens, Noam Cupertino, US 34 311
Shchegrov, Andrei V Campbell, US 72 924

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