Epoxy resin composition for sealing semiconductor device, and semiconductor device sealed by using same

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United States of America Patent

PATENT NO 10636712
APP PUB NO 20180053703A1
SERIAL NO

15554304

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Abstract

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An epoxy resin composition for sealing a semiconductor device, of the present invention, contains an inorganic filler, and the inorganic filler contains a nanomaterial containing silicon (Si) and aluminium (Al).

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Patent Owner(s)

  • SAMSUNG SDI CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bae, Kyoung Chul Uiwang-si, KR 5 8
Lee, Dong Hwan Uiwang-si, KR 160 854

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