LIQUID DISPERSION OF METAL NANOPARTICLES FOR SOLDER PASTE, METHOD FOR PRODUCING THE LIQUID DISPERSION, SOLDER PASTE, METHOD FOR PRODUCING THE SOLDER PASTE
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United States of America Patent
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Mar 24, 2016
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Mar 27, 2015
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Abstract
A liquid dispersion of metal nanoparticles for solder paste comprises metal nanoparticles made of an alloy and a reducing dispersion medium, wherein the metal nanoparticles have an average particle diameter of 1.0 to 200 nm, the metal nanoparticles have a sintering initiation temperature of less than 50° C., and the liquid dispersion comprises substantially no surfactant or surface modifier.
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