ADHESIVE FILM AND A FLAT WIRING MEMBER USING THE SAME

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United States of America Patent

SERIAL NO

15805547

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Abstract

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An adhesive film includes a resin film; and an adhesive layer provided on the resin film. The adhesive layer comprises a resin composition including 2 parts by mass or more of an epoxy resin including two or more epoxy groups in molecules and having epoxy equivalents of 300 g/eq or less, per 100 parts by mass of an amorphous resin, which is soluble to a solvent and has a plurality of carboxyl groups in molecules, and which has a glass transition temperature of 100° C. or less and an acid value of 5 KOHmg/g or more. A flat wiring member includes a conductor and the adhesive film as described above.

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Patent Owner(s)

Patent OwnerAddress
HITACHI METALS LTDTOKYO JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MURAKAMI, Kenichi Tokyo, JP 109 845
NAKAYAMA, Akinari Tokyo, JP 37 320
SASADA, Kazuhiko Tokyo, JP 4 17
SHANAI, Daisuke Tokyo, JP 14 55
YAMANOBE, Masanobu Tokyo, JP 1 1

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