APPARATUS AND METHOD FOR TREATING SUBSTRATE

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United States of America Patent

APP PUB NO 20180061641A1
SERIAL NO

15681314

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Abstract

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Disclosed is an apparatus for treating a substrate. The apparatus includes a process executing module and a controller. The process executing module includes a plurality of process chambers, and a transfer chamber provided with a main robot configured to transfer the substrate between the process chambers. The controller controls the process executing module to sequentially perform a first coating process of forming a first coating layer by supplying a first coating liquid onto the substrate having a pattern, an etching process of removing the first coating layer, by supplying a chemical to the substrate, and a second coating process of forming a second coating layer by supplying a second coating liquid onto the substrate. The process chambers include a first chamber configured to perform the first coating process, and a second chamber configured to perform the second coating process.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTD77 4SANDAN 5-GIL JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO 31040

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOI, YOUNG Chungcheongnam-do, KR 38 345
KWON, KYUNG RAN Chungcheongnam-do, KR 2 1
LEE, JUNG YUL Chungcheongbuk-do, KR 11 23
PARK, MIN JUNG Daegu, KR 27 89

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