Apparatus and method for treating substrate

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United States of America Patent

PATENT NO 10714352
APP PUB NO 20180061649A1
SERIAL NO

15681347

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Abstract

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Disclosed are an apparatus and a method for treating a substrate. The method includes repeatedly rotating the substrate alternately at a first speed and at a second speed while the treatment liquid is supplied, and the second speed is higher than the first speed.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTD77 4SANDAN 5-GIL JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO 31040

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Soo Hyun Chungcheongnam-do, KR 22 50
Lee, Hyun Hee Chungcheongnam-do, KR 29 157
Lee, Jung Yul Chungcheongbuk-do, KR 11 23
Park, Min Jung Daegu, KR 27 89

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