Barrier Layer Formation Using Thermal Processing
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United States of America Patent
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Aug 26, 2016
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Aug 26, 2016
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Abstract
A method of fabricating a semiconductor device includes forming a barrier layer over a surface of a semiconductor substrate. A treated barrier layer is formed by subjecting an exposed surface of the barrier layer to a surface treatment process. The surface treatment process includes treating the surface with a reactive material. A material layer is formed over the treated barrier layer. The material layer comprises a metal.
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