Semiconductor device with plated lead frame

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10748787
APP PUB NO 20180061671A1
SERIAL NO

15794155

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Abstract

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A semiconductor device includes an insulating carrier structure comprised of an insulating inorganic material. The carrier structure has a receptacle in which a semiconductor chip is disposed. The semiconductor chip has a first side, a second side and a lateral rim. The carrier structure laterally surrounds the semiconductor chip and the lateral rim. The semiconductor device also includes a metal structure on and in contact with the second side of the semiconductor chip and embedded in the carrier structure.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGNEUBIBERG

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brockmeier, Andre Villach, AT 39 429
Fastner, Ulrike Villach, AT 8 59
von, Koblinski Carsten Bodensdorf, AT 56 397
Zorn, Peter Villach, AT 10 26

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