Substrate treating apparatus and substrate treating method

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United States of America Patent

PATENT NO 10707101
APP PUB NO 20180061675A1
SERIAL NO

15677321

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Abstract

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Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating apparatus including a spin head configured to support the substrate, a nozzle configured to discharge a chemical to the substrate located on the spin head, a first passage configured to supply a first chemical, a chemical property of which is the same as the chemical, a second passage configured to supply a second chemical, a chemical property of which is the same as the first chemical, and a discharge passage connecting the first passage and the second passage, and the nozzle.

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Patent Owner(s)

Patent OwnerAddress
SEMES CO LTD77 4SANDAN 5-GIL JIKSAN-EUP SEOBUK-GU CHEONAN-SI CHUNGCHEONGNAM-DO 31040

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Heehwan Sejong-si, KR 15 19
Lee, Sul Incheon, KR 27 95

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