Fabrication of thin-film encapsulation layer for light emitting device
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United States of America Patent
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Oct 20, 2020
Grant Date -
Mar 1, 2018
app pub date -
Nov 2, 2017
filing date -
Dec 12, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e.g., without unintended gaps or holes) while providing for variable volume and, thus, contributes to variable ink/material buildup to achieve desired thickness. The ink is jetted as liquid or aerosol that suspends material used to form the material layer, for example, an organic material used to form an encapsulation layer for a flat panel device. The deposited layer is then cured or otherwise finished to complete the process.
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