Semiconductor devices and methods for forming a semiconductor device

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United States of America Patent

PATENT NO 10867893
APP PUB NO 20180061742A1
SERIAL NO

15685880

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Abstract

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A semiconductor device includes an electrically conductive contact pad structure. Moreover, the semiconductor device includes a bond structure. The bond structure is in contact with the electrically conductive contact pad structure at least at an enclosed interface region. Additionally, the semiconductor device includes a degradation prevention structure laterally surrounding the enclosed interface region. The degradation prevention structure is vertically located between a portion of the bond structure and a portion of the electrically conductive contact pad structure.

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Patent Owner(s)

Patent OwnerAddress
INFINEON TECHNOLOGIES AGNEUBIBERG

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ananiev, Sergey Ottobrunn, DE 7 52
Bauer, Robert Moosach, DE 61 1565
Koerner, Heinrich Bruckmuehl, DE 31 450
Tan, Yik Yee Melaka, MY 4 53
Walter, Juergen Regensburg, DE 3 77

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