Semiconductor package structure having a protection layer
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United States of America Patent
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Feb 19, 2019
Grant Date -
Mar 1, 2018
app pub date -
Aug 31, 2017
filing date -
Aug 31, 2016
priority date (Note) -
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Abstract
A semiconductor package structure includes a semiconductor substrate, at least one semiconductor die, an encapsulant, a protection layer, a plurality of conductive elements and a redistribution layer. The semiconductor die is disposed on the semiconductor substrate. The encapsulant covers at least a portion of the semiconductor die, and has a first surface and a lateral surface. The protection layer covers the first surface and the lateral surface of the encapsulant. The conductive elements surround the lateral surface of the encapsulant. The redistribution layer electrically connects the semiconductor die and the conductive elements.
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