METHOD FOR MANUFACTURING LIGHT EMITTING ELEMENT

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United States of America Patent

APP PUB NO 20180062025A1
SERIAL NO

15691559

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Abstract

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A method for manufacturing a light emitting element includes: forming a semiconductor structure on a first substrate; providing a second substrate configured to be bonded above a side of the semiconductor structure opposite the first substrate; forming a metal layer above at least one of (i) a side of the semiconductor structure opposite the first substrate, and/or (ii) a side of the second substrate that is to be located closer to the semiconductor structure; bonding the second substrate above the semiconductor structure via a bonding member; removing the first substrate from the semiconductor structure to obtain a bonded body in which the second substrate is bonded above the semiconductor structure; and singulating the bonded body.

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Patent Owner(s)

Patent OwnerAddress
NICHIA CORPORATION491-100 OKA KAMINAKA-CHO ANAN-SHI TOKUSHIMA 774-8601

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MURAMOTO, Eiji Tokushima-shi, JP 23 79

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