RF MODULE INCLUDING SAW DEVICE, METHOD OF MANUFACTURING THE RF MODULE, THE SAW DEVICE, AND METHOD OF MANUFACTURING THE SAW DEVICE
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United States of America Patent
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Issued Date -
Mar 1, 2018
app pub date -
Aug 18, 2017
filing date -
Aug 26, 2016
priority date (Note) -
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Abstract
Disclosed is a radiofrequency (RF) module including a surface acoustic wave (SAW) device that includes a piezoelectric substrate, an interdigital transducer (IDT) electrode and an input/output electrode formed on one surface of the piezoelectric substrate, and a bump joined to the input/output electrode, a printed circuit board (PCB) that includes a terminal corresponding to the input/output electrode and on which the SAW device is mounted to join the bump to the terminal, a molding portion that covers the SAW device, and a dam portion that surrounds the IDT electrode, the input/output electrode, and the bump not to allow a molding material that forms the molding portion to penetrate a space in which the IDT electrode, the input/output electrode, and the bump are arranged.
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