COPPER FOIL PROVIDED WITH CARRIER, LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE AND METHOD FOR FABRICATING PRINTED WIRING BOARD
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United States of America Patent
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Oct 31, 2017
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Feb 6, 2015
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Abstract
Provided is a copper foil provided with a carrier in which the laser hole-opening properties of the ultrathin copper layer are good and which is suitable for producing a high-density integrated circuit substrate. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein the specular gloss at 60° in an MD direction of the intermediate layer side surface of the ultrathin copper layer is 140 or less.
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