ELECTROMAGNETIC INTERFERENCE SUPPRESSION DEVICE AND METHOD FOR MANUFACTURING SAME

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United States of America Patent

SERIAL NO

15131203

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Abstract

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A method for manufacturing an EMI suppression device includes formulating a dielectric material from a polymer composite material that includes a thermoplastic resin /thermosetting resin and a conductive filler. A sheet that comprises the polymer composite filler is prepared. The top surface of the sheet is then laminated with a conductive foil. The laminated sheet is cut into one or more sections, where each section has a laminated top surface and a middle section that comprises the polymer composite material.

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Patent Owner(s)

Patent OwnerAddress
LITTELFUSE INC8755 WEST HIGGINS ROAD SUITE 500 CHICAGO IL 60631

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jianhua Sunnyvale, US 155 2004
Tsang, Chun-Kwan Morgan Hill, US 21 16

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