CONDUCTION-PATH-EQUIPPED MEMBER, METHOD FOR PATTERNING CONDUCTION PATH, AND METHOD FOR MEASURING CHANGES IN MEMBER

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United States of America Patent

SERIAL NO

15563309

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Abstract

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The present invention directly forms, on part of a member to be measured, a conduction path for measuring changes in said member. The present invention thus detects changes such as stress and displacement acting on a conduction-path-equipped member 30 intended for use in a structural member or the like. Consequently, circumstances generating stress in the member can be objectively monitored.

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Patent Owner(s)

Patent OwnerAddress
NEJILAW INC23-14 HONGO 3-CHOME BUNKYO-KU TOKYO 1130033 ?1130033

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MICHIWAKI, Hiroshi Tokyo, JP 26 109

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