Ultrasonic transducer of ultrasonic fingerprint sensor and manufacturing method thereof
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 20, 2019
Grant Date -
Mar 8, 2018
app pub date -
Apr 18, 2017
filing date -
Sep 5, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present disclosure discloses an ultrasonic transducer and a manufacturing method. The ultrasonic transducer for an ultrasonic fingerprint sensor comprises a piezoelectric layer, receiving electrode lines, emitting electrode lines, a substrate, connecting electrodes and bonding wires. Wherein the piezoelectric layer comprises an array of piezoelectric pillars. The plurality of receiving electrode lines are formed on the piezoelectric layer. The plurality of emitting electrode lines being formed beneath the piezoelectric layer. The substrate is formed under the emitting electrode lines. The connecting electrodes are formed under the substrate. The bonding wires are configured to connect the receiving electrode lines with the connecting electrodes and to connect the emitting electrode lines with the connecting electrodes.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully